1.1 Excellent electrical and thermal conductivity: second only to Ag in electrical conductivity.
Anti-magnetic metal: extremely low magnetization, used in compass, radar and other anti-magnetic field environment.
Small coefficient of friction: good friction reduction and wear resistance, high elastic limit and fatigue limit, especially containing Sn polycopper alloy wear parts, bushings, shingles, turbines, etc..
Electrode potential is very high (+0.34V): higher than hydrogen, good corrosion resistance.
Face-centered cubic lattice, no isotropic transition: high plasticity, easy to process.
Release of copper ions in aqueous media: Cu ions have the effect of inhibiting bacterial growth and the growth of aquatic organisms, and are therefore used in drinking water delivery pipes, washing machine inner tubes, and propellers of ships.
Bright color: pure copper is purplish red, alloying can be golden yellow, white.
1.2 Impurity elements. Industrial pure copper often contains a small amount of Pb, Bi, Ag, Cd, Fe, Ti, Se, Te, O, S, P, Zr and so on.
Ti, P, Fe, Si will significantly reduce the electrical and thermal conductivity of copper.
O, S, Se, Te will reduce the plasticity of copper violet.
A certain amount of S, Pb, Te will increase the ease of cutting of copper violet, but is unfavorable to welding.
O causes cold embrittlement and hydrogen embrittlement.
1.3 Role of alloying elements.
1.3.1 Formation of copper-based eutectic.
Ni, Al, Sn, Zn, Mn are the most effective solid solution strengthening elements in copper alloys.
P, Si, Fe, Co, Be, Al, Mn strongly reduce the electrical conductivity of copper, Ag, Cd, Cr has little effect on electrical conductivity.
Solute elements all reduce the thermal conductivity of copper to a greater extent.
1.3.2 Formation of intermetallic compounds. There is aging strengthening effect.
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