Electrolytic copper foil manufacturing process
1. Copper foil industry standards
The authoritative standards in the world include:
American ANSI/IPC standard, European IEC standard, Japanese JIS standard
IPC-CF-150 (1966.8) IPC-MF-150G (1999)
IEC-249-3A (1976)
JIS-C-6511 (1992) JIS-C-6512 (1992) JIS-C-6513 (1996)
GB/T-5230 (1995)
In March 2000, the American Electronic Circuit Interconnection and Packaging Association (IPC) released "Metal Foil for Printed Boards" (IPC-4562). The IPC-4562 standard is a world authoritative standard that fully regulates the variety, grade and performance of copper foil. It is world advanced and replaces the IPC-MF-150G standard implemented by most copper foil manufacturers in the world.
2. Classification of copper foil
01. According to different manufacturing methods of copper foil, it can be divided into two categories: rolled copper foil and electrolytic copper foil.
IPC-4562 stipulates the types and codes of metal foils according to their different manufacturing processes:
E-Electrolytic foil
W-Calendered foil
Electrolytic copper foil electrodeposited copper foil (ED copper foil) refers to copper foil made by electrodeposition
rolled copper foil rolled copper foil copper foil made by rolling method, also called wrought copper foil (wrought copper foil)
02.Classification of copper foil
Electrolytic copper foil has the following types:
Double treated copper foil refers to treating the rough side of the electrolytic copper foil and also processing the smooth side to make it rough.
High temperature and high elongation copper foil
high temperature elongation electrodeposited copper foil (referred to as HTE copper foil) is a copper foil that maintains excellent elongation at high temperature (180°C). Among them, the elongation of 35μm and 70μm thick copper foil at high temperature (180°C) should remain at room temperature. When the elongation is more than 30%, it is also called HD copper foil (high ductility copper foil).
low profile copper foil
Low profile copper foil, (LP for short) Generally, the microcrystals of the original copper foil are very rough, in the form of thick columnar crystals. Its slices cross the ridge lines of the fault and have large fluctuations. The crystals of low-profile copper foil are very fine (below 2 μm), are equiaxed grains, do not contain columnar crystals, are in the form of lamellar crystals, and have flat ridges.
resin coated copper foil (RCC for short)
It is also called resin-attached copper foil in China. Taiwan calls it: adhesive-backed copper foil. In foreign countries, it is also called: insulating resin sheet loaded on copper foil, adhesive film with copper foil.
03.Other categories
Adhesive coated copper foil (ACC for short)
Also known as "glued copper foil". Copper foil products coated with resin glue on the roughened surface of copper foil. Generally, resin glues are acetal-modified phenolic resin, epoxy-acrylate resin, cyanoacrylate-modified phenolic resin, etc. Glue-coated copper foil and resin-coated copper foil (RCC) are functionally different, and only serve as a bonding function between the copper foil and the insulating base material. Used in the manufacture of paper-based copper clad laminates and three-layer flexible copper clad laminates.
Copper foil for lithium ion battery
Copper foil used in the manufacture of negative electrode current collectors for lithium-ion batteries. This kind of copper foil serves as a carrier for the negative electrode material in the lithium battery, and also serves as a negative electrode electron collection and transport body. The copper foil used must have good electrical conductivity. It should ensure good contact with the active material and can be evenly coated on the negative electrode material without falling off. It should have good contact with the activity, good corrosion resistance, smooth surface and uniform thickness.
ultra thin copper foil ultra thin copper foil
Refers to copper foil for printed circuit boards with a thickness of less than 9 μm. Generally used copper foil is 12 μm or more in the outer layer of multi-layer boards, and 18 μm or more in the inner layer of multi-layer boards. Copper foil below 9μm is used on printed circuit boards for manufacturing fine circuits. Because extremely thin copper foil is difficult to handle, it is usually supported by a carrier. Types of carriers include copper foil, aluminum foil, organic film, etc.
